Magnetically coupled galvanically isolated communication using lead frame
AssigneePower Integrations, Inc.
InventorsBalu Balakrishnan, David Michael Hugh Matthews
Life of this patent
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Abstract
An integrated circuit package includes a lead frame and an encapsulation that substantially encloses the lead frame. The lead frame further includes a first conductor comprising a first conductive loop and a second conductor galvanically isolated from the first conductor, proximate to and magnetically coupled to the first conductive loop to provide a communication link between the first and second conductor. The second conductor includes a first conductive portion, a second conductive portion, and a wire coupling together the first conductive portion and the second conductive portion.
Claims20
An integrated circuit package, comprising:
- a lead frame, the lead frame comprising:
- a first conductor comprising a first conductive loop;
- and
- a second conductor galvanically isolated from the first conductor, proximate to and magnetically coupled to the first conductive loop to provide a communication link between the first and second conductors, wherein the second conductor comprises a first conductive portion, a second conductive portion, and a wire coupling together the first conductive portion and the second conductive portion, wherein substantially all of the second conductor surrounds the first conductor;
- and
- an encapsulation that substantially encloses the lead frame.
An integrated circuit package, comprising:
- a lead frame, the lead frame comprising:
- a first conductor having an inner conductive loop;
- a first die pad coupled to the first conductor, the first die pad having a switch die mounted thereon, wherein the switch die comprises a primary switch;
- and
- a second conductor galvanically isolated from the first conductor, wherein the second conductor comprises an outer conductive loop proximate to and magnetically coupled to the inner conductive loop to provide a communication link between the first and second conductors such that substantially all the outer conductive loop is outside the inner conductive loop;
- and
- an encapsulation that surrounds at least part of the lead frame.
Dependencies are inferred from the claim text.