Antenna apparatus and antenna module

An antenna module, comprising:

• feed vias;
• patch antenna patterns respectively electrically connected to ends of corresponding feed vias among the feed vias;
• a ground layer disposed in a position vertically lower than a position of the patch antenna patterns, and having through-holes through which the feed vias pass;
• a first conductive porous plate pattern disposed in a position vertically higher than the position of the ground layer, and having first through regions laterally surrounding the patch antenna patterns;
• and
• a second conductive porous plate pattern disposed in a position vertically higher than the position of the first conductive porous plate pattern, and having second through regions laterally surrounding the patch antenna patterns,
• wherein a total area of the second through regions is greater than a total area of the first through regions, and
• wherein a distance between inner and outer edges of the first conductive porous plate pattern is greater than a distance between inner and outer edges of the second conductive porous plate pattern.

An antenna apparatus, comprising:

• a core;
• a feed via disposed in the core;
• a patch antenna pattern disposed on a first surface of the core and electrically connected to the feed via;
• a ground layer disposed on a second surface of the core opposite the first surface of the core, and defining a through-hole through which the feed via passes;
• a first conductive ring pattern disposed on the first surface of the core and defining a first open space surrounding the patch antenna pattern in directions parallel to the first surface of the core;
• and
• a second conductive ring pattern disposed in a position spaced apart from the first conductive ring pattern in a direction perpendicular to the first surface of the core, and defining a second open space surrounding the patch antenna pattern in the directions parallel to the first surface of the core,
• wherein an area of the second open space is greater than an area of the first open space, and
• wherein a distance between inner and outer edges of the first conductive ring pattern in the directions parallel to the first surface of the core is greater than a distance between inner and outer edges of the second conductive ring pattern in the directions parallel to the first surface of the core.

An antenna apparatus, comprising:

• a feed via;
• a patch antenna pattern electrically connected to one end of the feed via;
• a ground layer disposed in a position vertically lower than a position of the patch antenna pattern, and having a through-hole through which the feed via passes;
• a first conductive ring pattern laterally spaced apart from the patch antenna pattern, and having a first central through region laterally surrounding the patch antenna pattern;
• a second conductive ring pattern disposed in a position vertically higher than a position of the first conductive ring pattern, and having a second central through region laterally surrounding the patch antenna pattern;
• a third conductive ring pattern disposed in a position vertically between the first conductive ring pattern and the second conductive ring pattern, and having a third central through region laterally surrounding the patch antenna pattern;
• first chain vias connecting the first conductive ring pattern and the third conductive ring pattern to each other, and laterally spaced apart from the patch antenna pattern;
• and
• second chain vias electrically connecting the second conductive ring pattern and the third conductive ring pattern to each other, and laterally spaced apart from the patch antenna pattern,
• wherein the second chain vias are respectively aligned with the first chain vias along vertical lines, and
• wherein a lateral distance from the first and second chain vias to an edge of the first conductive ring pattern bounding the first central through region is greater than a lateral distance from the first and second chain vias to an edge of the third conductive ring pattern bounding the third central through region, and the lateral distance from the first and second chain vias to the edge of the third conductive ring pattern is greater than the a lateral distance from the first and second chain vias to an edge of the second conductive ring pattern bounding the second central through region.