Thermal management method and apparatus for high frequency IC with apertured heat sink
AssigneeAnokiwave, Inc.
InventorsGaurav Menon, Jonathan P. Comeau, Andrew Street, Scott Mitchell, Robert J. McMorrow, Christopher Jones
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Abstract
An integrated circuit system has a die with first and second sides, and contains high frequency circuitry operating at mm-wave frequencies. The system also has a plurality of interfaces (on the first side) in electrical communication with the high frequency circuitry, and a heat sink having a bottom surface with a first region and an aperture region. The first region is in physical and conductive contact with the die, while the aperture region forms a concavity with an inner concave surface that is spaced from the die.
Claims6
An integrated circuit system comprising:
- a die containing high frequency circuitry operating at mm-wave frequencies, the die also having a first side and a second side;
- a plurality of interfaces on the first side, the plurality of interfaces being in electrical communication with the high frequency circuitry;
- and
- a heat sink having a bottom surface with a first region and an aperture region, the first region being in physical and conductive contact with the die, the aperture region forming a concavity with an inner concave surface that is spaced from the die.
Dependencies are inferred from the claim text.