Thin film solid-state microbattery packaging

A device, comprising:

• a substrate layer having a plurality of solid-state microbattery components disposed on a surface of the substrate layer;
• and
• a tape substrate layer that comprises a releasable adhesive material, a first polymer sealing material and a second polymer sealing material, wherein a conductive surface associated with the plurality of solid-state microbattery components is disposed under the releasable adhesive material of the tape substrate layer;
• a first cap wafer disposed on a first anode terminal of a first solid-state microbattery component of the plurality of solid-state microbattery components;
• a second cap wafer disposed on a second anode terminal of a second solid-state microbattery component of the plurality of solid-state microbattery components, wherein the first cap wafer is a first component and the second cap wafer is a second component, the first cap wafer and the second cap wafer being separate components, and the first polymer sealing material bonds the first cap wafer and the substrate layer, and the second polymer sealing material bonds the second cap wafer and the substrate layer, wherein the second polymer sealing material is separate from the first polymer sealing material.