Encapsulation method of organic light emitting diode device and encapsulation structure encapsulated using same
AssigneeWuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
InventorsMing Zhang, Hsianglun Hsu
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Abstract
An encapsulation method of an organic light emitting diode (OLED) device is provided. The encapsulation method includes steps of a substrate formed with the OLED device; forming at least an encapsulation film on a surface of the OLED device; and bonding a pre-formed barrier layer to an edge region of the encapsulation film. By bonding the pre-formed barrier layer to the edge region of the encapsulation film, the disclosure can achieve effects of improving an ability of moisture and oxygen resistance of the edge region of the OLED device, thereby improving reliability of encapsulation of the OLED device and prolonging lifetime of the OLED device.
Claims14
An encapsulation method of an organic light emitting diode (OLED) device, comprising steps of:
- providing a substrate formed with the OLED device;
- forming at least an encapsulation film on a surface of the OLED device;
- bonding a barrier layer to an edge region of the at least an encapsulation film, wherein the barrier layer is pre-formed;
- wherein the bonding process is a rolling bonding process or a vacuum bonding process;
- and
- wherein the barrier layer is a ring-shaped structure that surrounds the at least an encapsulation film.
An encapsulation method of an organic light emitting diode (OLED) device, comprising steps of:
- providing a substrate formed with the OLED device;
- forming at least an encapsulation film on a surface of the OLED device;
- and
- bonding a barrier layer to an edge region of the at least an encapsulation film, wherein the barrier layer is pre-formed.
Dependencies are inferred from the claim text.