Laminate and kit
AssigneeFUJIFILM Corporation
InventorsSeiya Masuda, Yoshitaka Kamochi, Atsushi Nakamura
Life of this patent
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AssigneeFUJIFILM Corporation
InventorsSeiya Masuda, Yoshitaka Kamochi, Atsushi Nakamura
Estimating the term…
Provided are a laminate which includes an organic semiconductor film, a water-soluble resin layer, and a photosensitive resin layer and in which cracks are unlikely to occur; and a kit. The laminate includes a water-soluble resin layer containing a water-soluble resin and a photosensitive resin layer containing a photosensitive resin, which are provided in this order on an organic semiconductor film. The water-soluble resin layer and the photosensitive resin layer are adjacent to each other, the water-soluble resin is at least one of polyvinylpyrrolidone having a weight-average molecular weight of 300,000 or greater or polyvinyl alcohol having a weight-average molecular weight of 15,000 or greater, and the photosensitive resin has a weight-average molecular weight of 30,000 or greater.
A laminate comprising:
A laminate comprising:
A laminate comprising:
Dependencies are inferred from the claim text.