Thermalization structure for cryogenic temperature devices
AssigneeInternational Business Machines Corporation
InventorsEric Peter Lewandowski, Bucknell C. Webb, Jared Barney Hertzberg, Martin O. Sandberg, Oblesh Jinka
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Abstract
A thermalization structure is formed using a foil and a low temperature device (LTD). The foil includes a first layer of a first material. The LTD includes a surface from which heat is transferred away from the LTD. A coupling is formed between the foil and the surface of the LTD, where the coupling includes a bond formed between the foil and the surface such that forming the bond forms a set of ridges in the foil, a ridge in the set of ridges operating to dissipate the heat.
Claims25
A thermalization structure, comprising:
- a foil comprising a first layer of a first material;
- a low temperature device (LTD) comprising a surface from which heat is transferred away from the LTD;
- and
- a coupling, wherein the coupling comprises a bond formed between the foil and the surface such that forming the bond forms a set of linear ridges in the foil, a ridge in the set of linear ridges operating to dissipate the heat.
A computer-implemented method for fabricating a thermalization structure, the computer-implemented method comprising:
- forming a foil comprising a first layer of a first material;
- floating, over a low temperature device (LTD) comprising a surface from which heat is transferred away from the LTD, the foil;
- and
- forming a coupling, wherein the coupling comprises a bond formed between the foil and the surface such that forming the bond forms a set of linear ridges in the foil, a ridge in the set of linear ridges operating to dissipate the heat.
A superconducting flip-chip device comprising:
- a low temperature device (LTD);
- and
- a thermalization structure, the thermalization structure comprising:
- a foil comprising a first layer of a first material;
- a surface of the LTD from which heat is transferred away from the LTD;
- and
- a coupling, wherein the coupling comprises a bond formed between the foil and the surface such that forming the bond forms a set of linear ridges in the foil, a ridge in the set of linear ridges operating to dissipate the heat.
A quantum data processing system comprising:
- a quantum processor comprising a low temperature device (LTD);
- and
- a thermalization structure, the thermalization structure comprising:
- a foil comprising a first layer of a first material;
- a surface of the LTD from which heat is transferred away from the LTD;
- and
- a coupling, wherein the coupling comprises a bond formed between the foil and the surface such that forming the bond forms a set of linear ridges in the foil, a ridge in the set of linear ridges operating to dissipate the heat.
Dependencies are inferred from the claim text.