Wirebond cross-talk reduction for quantum computing chips
AssigneeInternational Business Machines Corporation
InventorsDongbing Shao, Markus Brink
Life of this patent
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Abstract
A configuration of wirebonds for reducing cross-talk in a quantum computing chip includes a first wirebond coupling a first conductor of a quantum computing circuit with a first conductor of an external circuit. The embodiment further includes in the configuration a second wirebond coupling a second conductor of the quantum computing circuit with a second conductor of the external circuit, wherein the first wirebond and the second wirebond are separated by a first vertical distance in a direction of a length of the first conductor.
Claims15
A configuration of wirebonds for reducing cross-talk in a quantum computing chip, comprising:
- a first wirebond coupling a first conductor of a quantum computing circuit with a first conductor of an external circuit;
- and
- a second wirebond coupling a second conductor of the quantum computing circuit with a second conductor of the external circuit,
- wherein the first wirebond extends from a first wirebond coupling portion thereof on the quantum computing chip and the second wirebond extends from a second wirebond coupling portion thereof on the quantum computing chip, and
- wherein the first and second wirebond coupling portions are separated by a first vertical distance in a direction of a length of the first conductor.
A circuit fabrication system performing operations comprising:
- configuring a first wirebond to couple a first conductor of a quantum computing circuit on a quantum computing chip with a first conductor of an external circuit;
- and
- configuring a second wirebond to couple a second conductor of the quantum computing circuit with a second conductor of the external circuit,
- wherein the first wirebond extends from a first wirebond coupling portion thereof on the quantum computing chip and the second wirebond extends from a second wirebond coupling portion thereof on the quantum computing chip, and
- wherein the first and second wirebond coupling portions are separated by a first vertical distance in a direction of a length of the first conductor.
Dependencies are inferred from the claim text.