Back to results
US 10,833,235 B2Granted
Light source, method of manufacturing the light source, and method of mounting the light source
AssigneeNichia Corporation
InventorTakuji Hosotani
Life of this patent
Estimating the term…
Abstract
A light source includes a light emitting element configured to emit a light; a mounting substrate; and a ceramic substrate having a light emitting element mounted thereon and being bonded to the mounting substrate via a plurality of metal bumps made of gold, copper, a gold alloy, or a copper alloy. A method of manufacturing a light source includes forming a plurality of metal bumps on a mounting substrate; providing a ceramic substrate having at least one light emitting element mounted thereon; and bonding the mounting substrate and a ceramic substrate to each other via the metal bumps.
Claims20
A method of manufacturing a light source comprising:
- forming a plurality of metal bumps made of gold, copper, a gold alloy containing 90% or more by weight of gold, or a copper alloy on a mounting substrate, wherein each of the plurality of metal bumps has a diameter in a range of 60 μm to 120 μm;
- providing a ceramic substrate having at least one light emitting element mounted thereon, wherein the ceramic substrate comprises an alumina-based sintered body, a mullite-based sintered body, a silicon carbide-based sintered body, a glass ceramics-based sintered body, or aluminum nitride;
- and
- bonding the mounting substrate and the ceramic substrate to each other via the metal bumps at a temperature in a range of 100° C. to 200° C., while applying a pressure in a range of 1.0 kg/mm2 to 5.0 kg/mm2;
- wherein a density at which the plurality of metal bumps are arranged in a vicinity of a center of the ceramic substrate is higher than a density at which the plurality of metal bumps are arranged in a vicinity of an outer periphery of the ceramic substrate.
2 more elements
A method of manufacturing a light source comprising:
- forming a plurality of metal bumps made of gold, copper, a gold alloy containing 90% or more by weight of gold, or a copper alloy on a mounting substrate, wherein each of the plurality of metal bumps has a diameter in a range of 60 μm to 120 μm;
- placing a ceramic substrate on the mounting substrate, wherein the ceramic substrate comprises an alumina-based sintered body, a mullite-based sintered body, a silicon carbide-based sintered body, a glass ceramics-based sintered body, or aluminum nitride;
- bonding the mounting substrate and the ceramic substrate to each other via the metal bumps at a temperature in a range of 100° C. to 200° C., while applying a pressure in a range of 1.0 kg/mm2 to 5.0 kg/mm2;
- and
- mounting at least one light-emitting element on the ceramic substrate;
- wherein a density at which the plurality of metal bumps are arranged in a vicinity of a center of the ceramic substrate is higher than a density at which the plurality of metal bumps are arranged in a vicinity of an outer periphery of the ceramic substrate.
3 more elements
A method of manufacturing a light source comprising:
- forming a plurality of metal bumps made of gold, copper, a gold alloy containing 90% or more by weight of gold, or a copper alloy on a ceramic substrate, wherein each of the plurality of metal bumps has a diameter in a range of 60 μm to 120 μm, and wherein the ceramic substrate comprises an alumina-based sintered body, a mullite-based sintered body, a silicon carbide-based sintered body, a glass ceramics-based sintered body, or aluminum nitride;
- placing the ceramic substrate on a mounting substrate;
- bonding the mounting substrate and the ceramic substrate to each other via the metal bumps at a temperature in a range of 100° C. to 200° C., while applying a pressure in a range of 1.0 kg/mm2 to 5.0 kg/mm2;
- and
- mounting at least one light-emitting element on the ceramic substrate;
- wherein a density at which the plurality of metal bumps are arranged in a vicinity of a center of the ceramic substrate is higher than a density at which the plurality of metal bumps are arranged in a vicinity of an outer periphery of the ceramic substrate.
3 more elements
A method of manufacturing a light source comprising:
- forming a plurality of metal bumps made of gold, copper, a gold alloy containing 90% or more by weight of gold, or a copper alloy on a ceramic substrate on which at least one light-emitting element is mounted, wherein each of the plurality of metal bumps has a diameter in a range of 60 μm to 120 μm, and wherein the ceramic substrate comprises an alumina-based sintered body, a mullite-based sintered body, a silicon carbide-based sintered body, a glass ceramics-based sintered body, or aluminum nitride;
- placing the ceramic substrate on a mounting substrate;
- and
- bonding the mounting substrate and the ceramic substrate to each other via the metal bumps at a temperature in a range of 100° C. to 200° C., while applying a pressure in a range of 1.0 kg/mm2 to 5.0 kg/mm2;
- wherein a density at which the plurality of metal bumps are arranged in a vicinity of a center of the ceramic substrate is higher than a density at which the plurality of metal bumps are arranged in a vicinity of an outer periphery of the ceramic substrate.
2 more elements
A method of mounting comprising:
- forming a plurality of metal bumps made of gold, copper, a gold alloy containing 90% or more by weight of gold, or a copper alloy on a mounting substrate, wherein each of the plurality of metal bumps has a diameter in a range of 60 μm to 120 μm;
- and
- bonding the mounting substrate and a ceramic substrate placed on the mounting substrate to each other via the metal bumps at a temperature in a range of 100° C. to 200° C., while applying a pressure in a range of 1.0 kg/mm2 to 5.0 kg/mm2, wherein the ceramic substrate comprises an alumina-based sintered body, a mullite-based sintered body, a silicon carbide-based sintered body, a glass ceramics-based sintered body, or aluminum nitride;
- wherein a density at which the plurality of metal bumps are arranged in a vicinity of a center of the ceramic substrate is higher than a density at which the plurality of metal bumps are arranged in a vicinity of an outer periphery of the ceramic substrate.
1 more element
A method of mounting comprising:
- forming a plurality of metal bumps made of gold or a gold alloy containing 90% or more by weight of gold at a ceramic substrate, wherein each of the plurality of metal bumps has a diameter in a range of 60 μm to 120 μm, and wherein the ceramic substrate comprises an alumina-based sintered body, a mullite-based sintered body, a silicon carbide-based sintered body, a glass ceramics-based sintered body, or aluminum nitride;
- placing the ceramic substrate on a mounting substrate;
- and
- bonding the mounting substrate and the ceramic substrate to each other via the metal bumps at a temperature in a range of 100° C. to 200° C., while applying a pressure in a range of 1.0 kg/mm2 to 5.0 kg/mm2;
- wherein a density at which the plurality of metal bumps are arranged in a vicinity of a center of the ceramic substrate is higher than a density at which the plurality of metal bumps are arranged in a vicinity of an outer periphery of the ceramic substrate.
2 more elements
Dependencies are inferred from the claim text.