High optical power light conversion device using a phosphor element with solder attachment

A light conversion device comprising:

• a phosphor element comprising one or more phosphors embedded in a solid host element;
• a dielectric mirror coating disposed on a back side of the phosphor element;
• a solderable metal stack deposited on a back side of the dielectric mirror coating, wherein the dielectric mirror coating is disposed between the phosphor element and the solderable metal stack and wherein the dielectric mirror coating is a dielectric mirror designed to operate with a backside air interface;
• a metal heat sink;
• and
• a solder bond attaching the solderable metal stack to the metal heat sink.

A method of fabricating a light conversion device comprising:

• depositing a solderable metal stack on a back side of an optoceramic phosphor element comprising one or more phosphors embedded in a ceramic host by sputtering, plating, or vacuum metal evaporation of material that make up the solderable metal stack;
• prior to depositing the solderable metal stack on the back side of the optoceramic phosphor element, depositing a dielectric mirror coating on the back side of the optoceramic phosphor element, whereby the solderable metal stack is deposited on the dielectric mirror coating
• providing a metal heat sink as a metal disk that is rotatable about a central axis of the metal disk;
• and
• attaching the optoceramic phosphor element to an outer rim of the metal disk by soldering the solderable metal stack to the outer rim of the metal disk;
• wherein the dielectric mirror coating is a dielectric mirror designed to operate with a backside air interface.