Method for manufacturing a cover for an electronic package and electronic package comprising a cover

An electronic package, comprising:

• a carrier substrate;
• a first electronic chip having a back face fixed to a front mounting face of the carrier substrate and having a front face including at least one integrated optical element;
• and
• an encapsulation cover over said first electronic chip, said encapsulation cover comprising a substrate that is overmolded around a first optical insert configured to allow light radiation to pass from one side of the overmolded substrate to another side of the overmolded substrate, wherein said overmolded substrate is provided with a ring-shaped rib surrounding said first electronic chip at a distance,
• wherein said encapsulation cover is fixed at least above said mounting face of said carrier substrate in a position such that the encapsulation cover extends above the first electronic chip, the encapsulation cover being fixed above said carrier substrate by way of an adhesive mounting said ring-shaped rib.