Horizontal-trench capacitor
AssigneeInternational Business Machines Corporation
InventorsZheng Xu, Ruqiang Bao, Zhenxing Bi, Dongbing Shao
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AssigneeInternational Business Machines Corporation
InventorsZheng Xu, Ruqiang Bao, Zhenxing Bi, Dongbing Shao
Estimating the term…
Horizontal-trench on-chip capacitors are provided. In one aspect, a method of forming a capacitor includes: forming alternating sacrificial/active nanosheets on a wafer; patterning the nanosheets into a fin stack(s); burying the fin stack(s) in an ILD; removing the ILD from a first side of the fin stack(s), forming a first cavity; filling the first cavity with a semiconductor material that interconnects the nanosheets of the active material; implanting ions into the nanosheets, semiconductor material and wafer; removing the ILD from a second side of the fin stack(s) forming a second cavity; selectively removing the nanosheets of the sacrificial material, creating gaps between the nanosheets of the active material; depositing a dielectric into/lining the gaps and second cavity; and filling the gaps and second cavity with a conductor. A capacitor is also provided.
A method of forming a capacitor, the method comprising the steps of:
A method of forming a capacitor, the method comprising the steps of:
A capacitor, comprising:
Dependencies are inferred from the claim text.