Fan-out semiconductor package module

Abstract

A fan-out semiconductor package module that is easily manufactured includes a first connection member including a wiring layer, a first passive component mounted on the first connection member, a first encapsulation portion encapsulating at least a portion of the first connection member and the first passive component, a semiconductor chip having an active surface with a connection pad disposed thereon and an inactive surface opposing the active surface and disposed in a first through-hole penetrating through the first connection member and the first encapsulation portion, a second encapsulation portion covering at least a portion of the semiconductor chip and encapsulating at least a portion of the first encapsulation portion and the first connection member, and a second connection member disposed on the first connection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad and the first passive component.

Dependencies are inferred from the claim text.