Semiconductor storage device

A semiconductor storage device comprising:

• a housing;
• a first rigid board in the housing, the first rigid board comprising a plurality of first terminals on a surface of the first rigid board;
• a controller on the first rigid board;
• a second rigid board in the housing, the second rigid board facing at least in part the first rigid board, the second rigid board comprising a plurality of second terminals on a surface of the second rigid board;
• a first semiconductor memory component on the second rigid board, the first semiconductor memory component being configured to be controlled by the controller;
• and a first connection board in the housing in a state in which at least a part of the first connection board is bent, the first connection board comprising a first end portion and a second end portion, the first end portion comprising a plurality of third terminals connected to the plurality of first terminals of the first rigid board, the second end portion comprising a plurality of fourth terminals connected to the plurality of second terminals of the second rigid board,
• wherein the first connection board comprises a plurality of signal lines and a planar ground layer, the ground layer is closer to an outer side of the first connection board than the plurality of signal lines in a state in which the first connection board is bent, and the ground layer covers at least a part of each of the plurality of signal lines.

A semiconductor storage device comprising:

• a housing;
• a first rigid board in the housing, the first rigid board comprising a plurality of first terminals on a surface of the first rigid board;
• a controller on the first rigid board;
• a second rigid board in the housing, the second rigid board facing at least in part the first rigid board, the second rigid board comprising a plurality of second terminals on a surface of the second rigid board;
• a first semiconductor memory component on the second rigid board, the first semiconductor memory component being configured to be controlled by the controller;
• and
• a first connection board in the housing in a state in which at least a part of the first connection board is bent, the first connection board comprising a first end portion and a second end portion, the first end portion comprising a plurality of third terminals connected to the plurality of first terminals of the first rigid board, the second end portion comprising a plurality of fourth terminals connected to the plurality of second terminals of the second rigid board,
• wherein
• the plurality of first terminals are a plurality of pads to which a plurality of solder portions are bonded,
• the plurality of pads includes pads in a first row and pads in a second row, the first row being along a first direction, the second row being separated from the first row in a second direction that is different from the first direction, the second row being along the first direction, and
• the plurality of third terminals of the first end portion of the first connection board comprises terminals connected to the pads in the first row and terminals connected to the pads in the second row.