Integrated assemblies comprising vertically-stacked decks of memory arrays

An integrated assembly, comprising:

• a base comprising first circuitry;
• first conductive lines supported by the base and associated with the first circuitry, the first conductive lines extending along a first direction;
• a deck over the base and comprising an array of memory cells;
• second conductive lines supported by the deck and associated with the array of memory cells, the second conductive lines extending along a second direction substantially orthogonal to the first direction;
• and
• vertical interconnects extending from the deck to the base and coupling the first conductive lines to the second conductive lines;
• each of the vertical interconnects coupling one of the first conductive lines to one of the second conductive lines;
• each of the second conductive lines being coupled with only one of the first conductive lines;
• wherein the first and second conductive lines are on a same pitch as one another.