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US 10,833,058 B2Granted
Light emitting structure
AssigneeApple Inc.
InventorsJohn A. Higginson, Andreas Bibl, Hsin-Hua Hu
Life of this patent
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Abstract
A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
Claims15
A display comprising:
- a display substrate;
- a plurality of bottom conductive layers on the display substrate;
- a plurality of groups of LED devices connected to the plurality of bottom conductive layers, each group of LED devices connected to a corresponding bottom conductive layer;
- a passivation layer spanning across the display substrate and laterally surrounding each LED device in the plurality of groups of LED devices such that each LED device is embedded within the passivation layer;
- and
- a plurality of transparent top conductive layers directly over the passivation layer and in contact with the plurality of groups of LEDs.
3 more elements
Dependencies are inferred from the claim text.