Electrooptical device
AssigneeIhp GmbH—Innovations for High Performance Microelectronics/Leibniz-Institut Fur Innovative Mikroelektronik
InventorsPatrick Steglich, Andreas Mai, Christian Mai, Sigurd Schrader
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Abstract
The invention relates to an electrooptical device comprising a semiconductor substrate having a front side and a back side, at least one photonic component arranged on the front side of the semiconductor substrate, the photonic component comprising an active layer made of a non-linear optical material, wherein at least one cavity, extends through the semiconductor substrate and connects the active layer on the front side of the semiconductor substrate with the back side of the semiconductor substrate.
Claims16
An electrooptical device, comprising:
- a semiconductor substrate having a front side and a back side;
- at least one photonic component arranged on the front side of the semiconductor substrate, the photonic component comprising an active layer made of a non-linear optical material;
- wherein
- at least one cavity extends through the semiconductor substrate and connects the active layer on the front side of the semiconductor substrate with the back side of the semiconductor substrate.
A method for fabricating an electrooptical device, comprising:
- providing a semiconductor substrate having a front side and a back side;
- fabricating at least one photonic component comprising an active layer made of a non-linear optical material on the front side of the semiconductor substrate;
- wherein fabricating the at least one photonic component comprises
- fabricating a cavity starting from the back side of the semiconductor substrate, and extending the cavity at least to the front side of the semiconductor substrate and up to the photonic component;
- and
- forming the active layer of the photonic component by inserting the non-linear optical material through the cavity from the back side of the semiconductor substrate.
Dependencies are inferred from the claim text.