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US 10,833,055 B2Granted
Semiconductor device and optical coupling device
AssigneeKabushiki Kaisha Toshiba
InventorNaoya Takai
Life of this patent
Estimating the term…
Abstract
According to one embodiment, a semiconductor device includes a first semiconductor element having a first surface, a second semiconductor element having a lower surface bonded to the first surface of the first semiconductor element, a gel-like silicone that covers an upper surface of the second semiconductor element, and a resin portion that covers the gel-like silicone and the first surface of the first semiconductor element.
Claims9
A semiconductor device, comprising:
- a first semiconductor element on a surface of a substrate;
- a second semiconductor element having a lower surface bonded to an upper surface of the first semiconductor element;
- a rubber-like silicone covering an upper surface and a side surface of the second semiconductor element;
- a resin portion covering an outer surface of the rubber-like silicone and the first semiconductor element;
- a first gap between the rubber-like silicone and the resin portion on the upper surface of the second semiconductor element;
- and
- a second gap between the rubber-like silicone and the resin portion on the side surface of the second semiconductor element, wherein
- a thickness of the rubber-like silicone on the upper surface of the second semiconductor element is smaller than a thickness of the rubber-like silicone on the side surface of the second semiconductor element, the thicknesses being respectively measured along a direction normal to the upper surface of the second semiconductor element and the side surface of the second semiconductor element, and
- a spacing between the rubber-like silicone and the resin portion in the first gap is less than a maximum width spacing between the rubber-like silicone and the resin portion in the second gap.
6 more elements
A semiconductor device, comprising:
- a first semiconductor element on a surface of a substrate;
- a second semiconductor element having a lower surface bonded to an upper surface of the first semiconductor element;
- a rubber-like silicone covering an upper surface and a side surface of the second semiconductor element;
- and
- a resin portion covering an outer surface of the rubber-like silicone and the first semiconductor element;
- a first gap between the rubber-like silicone and the resin portion on the upper surface of the second semiconductor element;
- and
- a second gap between the rubber-like silicone and the resin portion on the side surface of the second semiconductor element, wherein a spacing between the rubber-like silicone and the resin portion in the first gap is less than a maximum width spacing between the rubber-like silicone and the resin portion in the second gap.
5 more elements
Dependencies are inferred from the claim text.