Precision alignment of multi-chip high density interconnects

A method comprising:

• placing a first semiconductor chip onto an upper surface of an alignment carrier with a first group of protrusions of the first semiconductor chip inserted into a corresponding first group of cavities on the upper surface of the alignment carrier, wherein the first groups of protrusions and cavities locate the first semiconductor chip with interconnect contacts of the first semiconductor chip overlying a vacant window that is formed through the alignment carrier;
• placing a second semiconductor chip onto the upper surface of the alignment carrier with a second group of protrusions of the second semiconductor chip inserted into a corresponding second group of cavities on the upper surface of the alignment carrier, wherein the second groups of protrusions and cavities locate the second semiconductor chip with interconnect contacts of the second semiconductor chip adjacent to the interconnect contacts of the first semiconductor chip and overlying the window;
• fastening the first and second semiconductor chips to the alignment carrier;
• and
• then touching contacts of an interconnect bridge against the interconnect contacts of the first and second semiconductor chips by putting the interconnect bridge through the window.