Interposer, electronic substrate, and method for producing electronic substrate
AssigneeLenovo (Singapore) Pte. Ltd.
InventorsTadashi Kosuga, Tin-Lup Wong
Life of this patent
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Abstract
An interposer is capable of efficiently reinforcing the connecting portion between an electronic component and a substrate. The interposer is used for mounting a first electronic component on a substrate and includes a sheet-shaped spacer having at least one through-hole and including a material that does not flow during reflow soldering and a resin portion that covers at least a part of the spacer and is flowable during reflow soldering, and the through-hole is configured to store a bump of the first electronic component.
Claims14
An interposer used for mounting a first electronic component on a substrate, the interposer comprising:
- a sheet-shaped spacer having at least one through-hole and including a material that is non-flowable during reflow soldering;
- and
- a resin portion that covers at least a part of the spacer and is flowable during reflow soldering, wherein:
- the through-hole is configured to receive a bump of the first electronic component.
An electronic substrate comprising:
- a substrate;
- a first electronic component having a bump mounted on the substrate;
- and
- an interposer including a sheet-shaped spacer having at least one through-hole for receiving the bump of the first electronic component and including a resin portion covering at least a part of the spacer, the interposer being interposed between the substrate and the first electronic component, wherein:
- an electrode of the substrate and the bump of the first electronic component are electrically connected through a first solder alloy, and
- the resin portion is physically connected to the substrate and the first electronic component.
A method for producing an electronic substrate, the method comprising:
- placing, on an upper face of a substrate, an interposer that includes a sheet-shaped spacer having at least one through-hole and including a material that is non-flowable during reflow soldering and includes a resin portion that covers at least a part of the spacer and is flowable during reflow soldering;
- packing a first solder alloy in the through-hole of the interposer;
- placing a first electronic component on an upper face of the interposer such that a bump of the first electronic component is in the through-hole of the interposer;
- and
- heating the substrate, the interposer, and the first electronic component at a temperature at which the first solder alloy melts and the resin portion is cured.
A method for producing an electronic substrate, the method comprising:
- attaching, to a first electronic component, an interposer that includes a sheet-shaped spacer having at least one through-hole and including a material that is non-flowable during reflow soldering and includes a resin portion that covers at least a part of the spacer and is flowable during reflow soldering such that a bump of the first electronic component is in the through-hole;
- applying a first solder alloy onto an electrode of a substrate;
- placing the interposer on the substrate such that the through-hole is located on the electrode of the substrate;
- and
- heating the substrate, the interposer, and the first electronic component at a temperature at which the first solder alloy melts and the resin portion is cured.
Dependencies are inferred from the claim text.