Method for electrical coupling and electric coupling arrangement

A coupling arrangement, comprising:

• an electrically conducting pad having a flat surface;
• an electrically conducting pillar having a front face with a convex curvature, a central region of the convex curvature vertically aligned with the electrically conducting pad;
• and
• an electrically conducting connection structure arranged between the flat surface of the pad and the front face with convex curvature of the pillar, wherein the connection structure includes a plurality of microparticles and a plurality of nanoparticles bonded together and arranged as percolation paths that form the electrically conducting connection structure along an axis extending vertically between the central region of the front face with the convex curvature of the pillar and the pad with pores between the percolation paths such that the electrically conducting connection structure remains intact in response to shearing forces resulting from a difference between thermal extension coefficients at the pad and at the pillar based on a ratio selected between the nanoparticles and microparticles.