Stack tool for reflow and stack apparatus having the same

A stack tool comprising:

• a lower jig having a plurality of package seating regions configured to seat a semiconductor package;
• an intermediate jig having a package support hole configured to support the semiconductor package and having a shape corresponding to each of the plurality of package seating regions;
• and
• an upper dumbbell on top of the intermediate jig, the upper dumbbell including,
• a dumbbell main body, the dumbbell main body having a first region corresponding to an upper surface of the semiconductor package, the first region having a volume less than each of the plurality of package seating regions, wherein
• a portion of a bottom surface of the upper dumbbell is configured to contact a portion of a top surface of the intermediate jig.

A stack tool comprising:

• a lower jig having a plurality of package seating regions configured to seat a semiconductor package;
• an intermediate jig having a package support hole configured to support the semiconductor package and having a shape corresponding to each of the plurality of package seating regions;
• and
• an upper dumbbell on top of the intermediate jig, the upper dumbbell including,
• a dumbbell main body, the dumbbell main body having a first region corresponding to an upper surface of the semiconductor package, the first region having a volume less than each of the plurality of package seating regions
• wherein the dumbbell main body includes an upper recess in a recess shape stepped down from an upper surface of the dumbbell main body, the upper recess being in a second region, the second region corresponding to the upper surface of the semiconductor package.