Substrate processing apparatus and manufacturing method of substrate holding unit
AssigneeTokyo Electron Limited
InventorsYoshitaka Otsuka, Munehisa Kodama, Takashi Terada
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AssigneeTokyo Electron Limited
InventorsYoshitaka Otsuka, Munehisa Kodama, Takashi Terada
Estimating the term…
A substrate processing apparatus 30 includes a first holding unit 200 configured to hold a processing target substrate W; a second holding unit 300 disposed to face the first holding unit 200 and configured to hold a support substrate S; and an ultraviolet irradiation unit 400 configured to irradiate an ultraviolet ray to an adhesive G provided between the processing target substrate W and the support substrate S. Each of the support substrate S and the second holding unit 300 is made of an ultraviolet transmissive material. An electrode 320 configured to electrostatically attract the support substrate S is provided within the second holding unit 300. A diffusion layer 330 configured to diffuse a transmission direction of the ultraviolet ray is provided at a position closer to the support substrate S between the support substrate S and the electrode 320 within the second holding unit 300.
A substrate processing apparatus configured to perform a preset processing on a processing target substrate and a support substrate, the substrate processing apparatus comprising:
Dependencies are inferred from the claim text.