Package-on-package assembly with wire bonds to encapsulation surface

A method for forming a microelectronic package, comprising:

• obtaining a substrate having first contacts on an upper surface thereof;
• obtaining a microelectronic die having a lower surface and having second contacts on an upper surface of the microelectronic die;
• attaching the lower surface of the microelectronic die to face the upper surface of the substrate;
• bonding wire bonds to the first contacts including forming bases of the wire bonds;
• wherein edge surfaces of the wire bonds extend from the bases and are located between the bases and corresponding end surfaces of the wire bonds;
• wherein first ones of the wire bonds are interconnected between a first portion of the first contacts and the second contacts;
• forming a dielectric structure above the upper surface of the substrate and the microelectronic die and between the bases of the wire bonds;
• wherein the end surfaces of second ones of the wire bonds are located above the upper surface of the microelectronic die and separated therefrom by a portion of the dielectric structure located above the upper surface of the microelectronic die;
• and
• interconnecting a stack of microelectronic elements to the substrate via the second ones of the wire bonds with the stack located over the microelectronic die.