Laser ablation for wire bonding on organic solderability preservative surface

A method comprising:

• providing a substrate layer;
• providing a copper layer disposed on the substrate layer;
• providing an organic solderability preservative (OSP) layer disposed on the copper layer;
• exposing a surface of the copper layer by applying a laser beam from a laser on the OSP layer, the applied laser beam removing an amount of the copper layer such that a thickness of the copper layer under the exposed surface is less than a thickness of the copper layer that is under the OSP layer;
• and
• providing a connection between a component and the exposed surface of the copper layer.