Semiconductor package

A semiconductor package comprising:

• a core member having first and second surfaces opposing each other, having a cavity penetrating through the first and second surfaces, and including a wiring structure connecting the first and second surfaces to each other;
• a semiconductor chip disposed in the cavity of the core member and having an active surface having connection pads disposed thereon;
• a stack-type passive component module disposed in the cavity of the core member, the stack-type passive component module comprising:
• first and second passive component modules including, respectively, a plurality of passive components and resin portions encapsulating the plurality of passive components, and having, respectively, first surfaces from which connection terminals of the plurality of passive components are exposed and second surfaces opposing the first surfaces,
• wherein the second surfaces of the first and second passive component modules face each other, and the first surfaces of the first and second passive component modules are provided as upper and lower surfaces, respectively;
• a connection member disposed on the second surface of the core member and including a first redistribution layer connected to the connection pads of the semiconductor chip and the connection terminals of some of the first and second passive components disposed on the lower surface of the stack-type passive component module, the connection terminals of the others of the first and second passive components disposed on the lower surface of the stack-type passive component module not being connected to the first redistribution layer;
• an encapsulant covering the first surface of the core member and encapsulating the stack-type passive component module and the semiconductor chip;
• and
• a second redistribution layer disposed on the encapsulant and connected to the wiring structure of the core member and the connection terminals of some of the first and second passive components disposed on the upper surface of the stack-type passive component module, the connection terminals of the others of the first and second passive components disposed on the upper surface of the stack-type passive component module not being connected to the second redistribution layer.