Back to results
US 10,833,039 B2Granted
Multi-chip fan out package and methods of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Jing-Cheng Lin, Jui-Pin Hung
Life of this patent
Estimating the term…
Abstract
A package includes a die having a conductive pad at a top surface of the die, a stud bump over and connected to the conductive pad, and a redistribution line over and connected to the stud bump. An electrical connector is over and electrically coupled to the redistribution line.
Claims20
A method comprising:
- placing a first device die over a carrier, the first device die comprising a surface conductive feature;
- after the first device die is placed on the carrier, forming a first stud bump on the first device die;
- forming a second stud bump on a second device die through wire bonding;
- sawing a wafer comprising the second device die and the second stud bump into discrete dies, wherein the discrete dies comprise the second device die;
- placing the second device die over the carrier;
- encapsulating the first device die and the second device die in an encapsulant;
- performing a planarization to planarize top surfaces of the encapsulant, the first stud bump, and the second bump;
- and
- forming redistribution lines over and electrically coupling to the first stud bump and the surface conductive feature.
6 more elements
A method comprising:
- forming a first device die comprising a first stud bump at a surface of the first device die;
- placing the first device die having the first stud bump over a carrier;
- placing a second device die over the carrier;
- when the second device die is on the carrier, performing a wire bonding to form a second stud bump on the second device die;
- encapsulating the first device die and the second device die in an encapsulant, wherein the encapsulant contacts sidewalls of a bond ball and a bond wire of the second stud bump;
- and
- forming a plurality of redistribution lines electrically coupling to the first stud bump and the second stud bump.
4 more elements
A method comprising:
- placing a first device die over a carrier, the first device die comprising:
- a first conductive pad;
- and
- a first stud bump over and electrically connecting to the first conductive pad, wherein the first stud bump comprises a bond stud contacting the first conductive pad, and a bond wire connected to the bond stud;
- placing a second device die over the carrier;
- after the second device die is placed, forming a second stud bump on a second conductive pad of the second device die;
- encapsulating the first device die and the second device die in an encapsulant;
- and
- forming a plurality of redistribution lines electrically coupling to the first stud bump and the second stud bump.
6 more elements
Dependencies are inferred from the claim text.