Dual bond pad structure for photonics
AssigneeInternational Business Machines Corporation
InventorsJeffrey P. Gambino, Richard S. Graf, Robert K. Leidy, Jeffrey C. Maling
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Abstract
A dual bond pad structure for a wafer with laser die attachment and methods of manufacture are disclosed. The method includes forming a bonding layer on a surface of a substrate. The method further includes forming solder bumps on the bonding layer. The method further includes patterning the bonding layer to form bonding pads some of which comprise the solder bumps thereon. The method further includes attaching a laser diode to selected bonding pads using solder connections formed on the laser diode. The method further includes attaching an interposer substrate to the solder bumps formed on the bonding pads.
Claims19
A structure comprising:
- a first set of bond pads and a second set of bond pads;
- solder bumps electrically connected to the first set of bond pads, the solder bumps having a first height;
- an interposer substrate electrically connected to the solder bumps;
- solder connections directly connected to a laser diode and connected to the second set of bond pads, the solder connections having a second height smaller than the first height and the laser diode being positioned with no intervening components between the laser diode and the interposer substrate;
- a plurality of metal plates being in direct contact with a bottom surface of the second set of bond pads and a top surface of the solder connections,
- wherein the interposer substrate has a planar surface, the solder bumps directly contact the planar surface, and a surface of the laser diode opposing the solder connections is above the planar surface of the interposer substrate such that a space is provided between the planar surface and the surface of the laser diode;
- and
- a back end of the line (BEOL) structures layer above the first set of bond pads and the second set of bond pads, and the BEOL structures comprise a plurality of wiring and interconnect structures.
Dependencies are inferred from the claim text.