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US 10,833,036 B2Granted
Interconnect for electronic device
AssigneeTexas Instruments Incorporated
InventorsPatrick Francis Thompson, Christopher Daniel Manack, Stefan Herzer, Rakshit Agrawal
Life of this patent
Estimating the term…
Abstract
A semiconductor die includes a substrate and an integrated circuit provided on the substrate and having contacts. An electrically conductive layer is provided on the integrated circuit and defines electrically conductive elements electrically connected to the contacts. Electrically conductive interconnects coupled with respective electrically conductive elements. The electrically conductive interconnects have at least one of different sizes or shapes from one another.
Claims18
A semiconductor die comprising:
- a substrate;
- an integrated circuit provided on the substrate and including contacts;
- an electrically conductive layer provided on the integrated circuit and defining electrically conductive elements electrically connected to the contacts;
- and
- electrically conductive interconnects coupled to respective electrically conductive elements, the electrically conductive interconnects including at least one of different sizes or shapes from one another, wherein at least one electrically conductive element is in between fingers of another electrically conductive element, and wherein at least one of the electrically conductive interconnects is electrically connected to at least two of the electrically conductive elements, and wherein each electrically conductive interconnect comprises a first portion including tin and a second portion including copper and positioned between the first portion and the electrically conductive layer.
2 more elements
An electronic package comprising:
- a die comprising:
- a substrate;
- an integrated circuit provided on the substrate and including contacts;
- an electrically conductive layer provided on the integrated circuit and defining electrically conductive elements electrically connected to the contacts;
- electrically conductive interconnects coupled to selected electrically conductive elements, the electrically conductive interconnects including at least one of different sizes or shapes from one another, wherein at least one electrically conductive element is in between fingers of another electrically conductive element;
- a portion of a leadframe attached to the electrically conductive interconnects, wherein each electrically conductive interconnect comprises a first portion including tin and a second portion including copper and positioned between the first portion and the electrically conductive layer.
3 more elements
Dependencies are inferred from the claim text.