Method of forming solder bumps
AssigneeInternational Business Machines Corporation
InventorsToyohiro Aoki, Takashi Hisada, Hiroyuki Mori, Eiji Nakamura, Yasumitsu Orii
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Abstract
A method of forming solder bumps includes preparing a substrate having a surface on which a plurality of electrode pads are formed, forming a resist layer on the substrate, the resist layer having a plurality of openings, each of the openings being aligned with a corresponding electrode pad of the plurality of electrode pads, forming a conductive pillar in each of the openings of the resist layer, forming conductive layers to cover at least side walls of the resist layer in the openings to block gas emanating from the resist layer, filling molten solder in each of the openings in which the conductive layers has been formed and removing the resist layer.
Claims20
A method of forming solder bumps, the method includes:
- forming a conductive pillar in each opening of a resist layer on a substrate, the resist layer having a plurality of openings aligned with a corresponding electrode pad of a plurality of electrode pads;
- forming conductive layers to cover at least side walls of the resist layer in the openings, the conductive layers being configured to block gases emanating from the resist layer as a result of outgassing;
- and
- filling molten solder in each of the openings in which the conductive layers has been formed.
A method of forming solder bumps, the method includes:
- forming a conductive pillar in each opening of a resist layer on a substrate, the resist layer having a plurality of openings, each of the openings being aligned with a corresponding electrode pad of a plurality of electrode pads;
- filling conductive paste in the openings of the resist layer;
- sintering the conductive paste in the openings to form conductive layers to cover side walls of the resist layer, the conductive layers being configured to block gas emanating from the resist layer as a result of outgassing, and surfaces of the plurality of electrode pads in the openings, wherein spaces on the conductive layers leading to an upper end of the openings are formed;
- and
- filling molten solder in the spaces on the conductive layers.
Dependencies are inferred from the claim text.