Back to results
US 10,833,034 B2Granted
Semiconductor package
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorShih-Cheng Chang
Life of this patent
Estimating the term…
Abstract
The present disclosure provides a semiconductor package, including a substrate, an active region in the substrate, an interconnecting layer over the active region, a conductive pad over the interconnecting layer, surrounded by a dielectric layer. At least two discrete regions of the conductive pad are free from coverage of the dielectric layer. A method of manufacturing the semiconductor package is also disclosed.
Claims20
A semiconductor package, comprising:
- a substrate;
- an active region in the substrate;
- an interconnecting layer over the active region;
- a conductive pad over the interconnecting layer, surrounded by a dielectric layer, wherein at least two discrete regions of the conductive pad are free from coverage of the dielectric layer;
- and
- a conductive bump over the conductive pad and the dielectric layer, the conductive bump comprises at least two protrusions separated by the dielectric layer and a pillar on the protrusions;
- wherein the material of each of the protrusions is different to the material of the pillar.
4 more elements
A semiconductor package, comprising:
- a semiconductor chip, comprising:
- a substrate;
- an active region in the substrate;
- an interconnecting layer over the active region;
- a plurality of conductive pads, each on the interconnecting layer and surrounded by a dielectric layer;
- and
- a plurality of conductive bumps, each over corresponding conductive pad and comprises a pillar and at least two protrusions therebelow separated by the dielectric layer, and the at least two protrusions are aligned to at least two discrete regions of the corresponding conductive pad from a top view perspective;
- and
- a package substrate joining to the semiconductor chip through the plurality of conductive bumps;
- wherein the material of each of the protrusions is different to the material of the pillar.
7 more elements
A semiconductor package, comprising:
- a semiconductor chip, comprising:
- a substrate;
- an active region in the substrate;
- an interconnecting layer over the active region;
- a plurality of conductive pads, each on the interconnecting layer and surrounded by a dielectric layer;
- and
- a plurality of conductive bumps, each over corresponding conductive pad, at least one of the conductive bumps proximity to an edge of the semiconductor chip being in contact with at least two discrete regions of the corresponding conductive pad;
- and
- a package substrate having a convex surface facing the semiconductor chip and joining the semiconductor chip through the plurality of conductive bumps.
6 more elements
Dependencies are inferred from the claim text.