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US 10,833,033 B2Granted
Bump structure having a side recess and semiconductor structure including the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Horng Chang, Tin-Hao Kuo, Chen-Shien Chen, Yen-Liang Lin
Life of this patent
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Abstract
The present disclosure, in some embodiments, relates to a bump structure. The bump structure includes a conductive layer and a solder layer. The solder layer is disposed vertically below and laterally between portions of the conductive layer along a cross-section. The conductive layer is continuous between the portions.
Claims20
A bump structure, comprising:
- a conductive layer on a substrate;
- a solder layer arranged on the conductive layer;
- and
- wherein the conductive layer has a curved surface that defines a recess within a side of the conductive layer, the solder layer disposed within the recess and covering an entirety of the curved surface as viewed along a cross-sectional view.
1 more element
A conductive bump structure, comprising:
- a conductive layer having one or more surfaces defining a recess along a side of the conductive layer;
- a solder material extending from below the conductive layer to within the recess;
- and
- wherein the conductive layer has a greater thickness measured through a center of the conductive layer than along the one or more surfaces defining the recess.
1 more element
A bump structure, comprising:
- a conductive layer having one or more surfaces that define a recess along a side of the conductive layer;
- a solder layer over the conductive layer;
- and
- wherein the solder layer comprises one or more surfaces defining a protrusion that extends outward from a horizontally extending surface of the solder layer facing the conductive layer to within the recess, wherein the protrusion extends to a bottom of the one or more surfaces defining the recess.
1 more element
Dependencies are inferred from the claim text.