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US 10,833,031 B2Granted
Pad design for reliability enhancement in packages
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorHsien-Wei Chen
Life of this patent
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Abstract
A package includes a corner, a device die, a molding material molding the device die therein, and a plurality of bonding features. The plurality of bonding features includes a corner bonding feature at the corner, wherein the corner bonding feature is elongated. The plurality of bonding features further includes an additional bonding feature, which is non-elongated.
Claims20
A method comprising:
- forming a package comprising:
- encapsulating a device die and a through-via in an encapsulant;
- forming a redistribution line electrically coupling to the through-via, wherein the redistribution line comprises a first metal pad, and a first via connecting the first metal pad to the through-via, and the first metal pad is elongated in a plane view of the package;
- forming a first dielectric layer, wherein the redistribution line is in the first dielectric layer;
- and
- forming a second dielectric layer, wherein the first metal pad contacts the second dielectric layer;
- removing the second dielectric layer;
- recessing the first dielectric layer to reveal sidewalls of the first metal pad;
- and
- applying a solder region contacting a top surface and the revealed sidewalls of the first metal pad.
7 more elements
A method comprising:
- encapsulating a metal post and a device die in an encapsulant;
- forming a first dielectric layer, wherein the device die is attached to the first dielectric layer through a die-attach film;
- forming a first redistribution line in the first dielectric layer, wherein the first redistribution line comprises a first via and a first metal pad;
- and
- etching the first dielectric layer to expose top portions of sidewalls of the first metal pad, wherein bottom portions of the sidewalls of the first metal pad are in contact with the first dielectric layer, and wherein both of the first metal pad and the metal post are elongated in a plane view of the first metal pad and the metal post.
2 more elements
A method comprising:
- forming a package comprising:
- encapsulating a device die and a through-via in an encapsulant;
- forming a redistribution line electrically coupling to the through-via, wherein the redistribution line comprises a first metal pad, and a first via connecting the first metal pad to the through-via, and the first metal pad is elongated in a plane view of the package;
- forming a first dielectric layer, wherein the redistribution line is in the first dielectric layer;
- and
- forming a second dielectric layer, wherein the first metal pad contacts the second dielectric layer;
- removing the second dielectric layer;
- recessing the first dielectric layer to reveal sidewalls of the first metal pad, wherein the recessing the first dielectric comprises etching the first dielectric layer;
- and
- applying a solder region contacting a top surface and the revealed sidewalls of the first metal pad, wherein at a time the solder region is applied, a bottom portion of the first dielectric layer remains.
7 more elements
Dependencies are inferred from the claim text.