Substrate structure, packaging method and semiconductor package structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorChang Yi Yang
Life of this patent
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Abstract
A substrate structure includes a substrate body, at least one first mold area and at least one second mold area. The substrate body has a first surface and a second surface opposite to the first surface, and defines at least one first through hole extending through the substrate body. The first mold area is disposed on the first surface of the substrate body. The second mold area is disposed on the second surface of the substrate body, wherein the first mold area is in communication with the second mold area through the first through hole.
Claims20
A substrate structure, comprising:
- a substrate body having a first surface, a second surface opposite to the first surface, a first area on the first surface and a second area on the second surface, and defining at least one first through hole communicating the first area with the second area, at least one second through hole located on a first side of the substrate body and is outside the first area and the second area, and at least one air venting hole located on a second side of the substrate body and is outside the first area and the second area, wherein the first side is opposite to the second side;
- a first circuit layer disposed adjacent to the first surface of the substrate body, wherein the first area is an area within an outer boundary of the first circuit layer;
- and
- a second circuit layer disposed adjacent to the second surface of the substrate body, wherein the second area is an area within an outer boundary of the second circuit layer, and a position outside the first area and the second area is outside of the outer boundaries of the first circuit layer and the second circuit layer.
A semiconductor package structure, comprising:
- a substrate body having a first surface and a second surface opposite to the first surface, and defining at least one first through hole extending through the substrate body, wherein the first through hole is exposed from a side surface of the substrate body, the substrate body includes an exposed area on the second surface;
- at least one first chip disposed on the first surface of the substrate body;
- at least one first encapsulant disposed on the first surface of the substrate body, and covering the first chip;
- at least one second chip disposed on the second surface of the substrate body;
- at least one second encapsulant disposed on the second surface of the substrate body, and covering the second chip, wherein the exposed area of the substrate body is defined by the second surface of the substrate body and two inner surfaces of the second encapsulant, and the two inner surfaces of the second encapsulant are non-parallel with each other;
- and
- at least one third encapsulant disposed in the first through hole, wherein the third encapsulant connects the first encapsulant and the second encapsulant.
Dependencies are inferred from the claim text.