Method of forming a packaged semiconductor device using ganged conductive connective assembly and structure

A packaged semiconductor device comprising:

• a die attach pad;
• leads disposed proximate to the die attach pad, each lead having a lead bottom surface and a lead end surface;
• a semiconductor device coupled to the die attach pad;
• a conductive clip comprising a die attach portion attached to the semiconductor device, a bonding portion connected to the die attach portion and to at least two leads, and a first tie bar directly attached to the die attach portion;
• a package body encapsulating the semiconductor device, the conductive clip, portions of the leads, at least a portion of the first tie bar, and at least a portion of the die attach pad, wherein each lead end surface is exposed from first portions of a side surface of the package body, and wherein an end surface of the first tie bar is exposed from a second portion of the side surface of the package body;
• and
• a conductive layer disposed on each lead end surface but not disposed on the end surface of the first tie bar.

A packaged semiconductor device comprising:

• a die attach pad, the die attach pad having a die attach pad top surface and a die attach pad bottom surface;
• leads disposed proximate to the die attach pad, each lead having a lead bottom surface and a lead end surface;
• a semiconductor device coupled to the die attach pad top surface;
• a conductive clip attached to the semiconductor device and at least one of the leads, wherein the conductive clip comprises:
• a die attach portion attached to the semiconductor device;
• a bonding portion connected to the die attach portion and to at least two leads;
• a first tie bar extending from a first side surface of the die attach portion;
• a package body encapsulating the semiconductor device, the conductive clip, portions of the leads, at least a portion of the first tie bar, and at least a portion of the die attach pad, wherein:
• each lead end surface is exposed from a first side surface of the package body;
• and
• an end surface of the first tie bar is exposed from a second side surface of the package body that is different than the first side surface;
• and
• a conductive layer disposed on each lead end surface but not disposed on the end surface of the first tie bar.