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US 10,832,999 B2Granted
Packaging methods for semiconductor devices comprising forming trenches in separation regions between adjacent packaging substrates
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKuei-Wei Huang, Wei-Hung Lin, Chih-Wei Lin, Chun-Cheng Lin, Meng-Tse Chen, Ming-Da Cheng, Chung-Shi Liu
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Abstract
Packaging methods for semiconductor devices are disclosed. A method of packaging a semiconductor device includes providing a workpiece including a plurality of packaging substrates. A portion of the workpiece is removed between the plurality of packaging substrates. A die is attached to each of the plurality of packaging substrates.
Claims20
A method comprising:
- forming a first packaging substrate and a second packaging substrate in a workpiece, wherein the workpiece comprises a ceramic material, a plastic material, or an organic material, and wherein a separation region is interposed between the first packaging substrate and the second packaging substrate;
- removing a top portion of the separation region to form a top trench in the workpiece;
- removing a bottom portion of the separation region to form a bottom trench in the workpiece, wherein the top trench and the bottom trench are vertically aligned, and wherein at least a portion of the separation region is interposed between a bottom of the top trench and a bottom of the bottom trench;
- and
- bonding a die to each of the first packaging substrate and the second packaging substrate.
2 more elements
A method comprising:
- forming a first packaging substrate and a second packaging substrate in a workpiece, wherein a separation region is interposed between the first packaging substrate and the second packaging substrate;
- forming a solder mask on a first surface of the workpiece;
- forming a plurality of contact pads on a second surface of the workpiece, wherein the second surface of the workpiece is opposite to the first surface of the workpiece;
- removing a portion of the solder mask and a portion of the separation region to form a trench, wherein each of the plurality of contact pads is closer to the second surface of the workpiece than a bottom of the trench;
- and
- attaching a die to each of the first packaging substrate and the second packaging substrate.
3 more elements
A method comprising:
- forming a first packaging substrate and a second packaging substrate in a workpiece, wherein a separation region is interposed between the first packaging substrate and the second packaging substrate;
- forming a dielectric material on a first surface of the workpiece;
- forming a plurality of bond pads over the dielectric material;
- forming a solder mask over the plurality of bond pads and the dielectric material;
- forming a plurality of contact pads on a second surface of the workpiece, wherein the second surface of the workpiece is opposite to the first surface of the workpiece;
- after forming the plurality of contact pads, removing at least a portion of the solder mask over the separation region to form a recess, wherein each of the plurality of contact pads is closer to the second surface of the workpiece than a bottom surface of the recess;
- and
- after forming the recess, bonding a die to each of the first packaging substrate and the second packaging substrate.
5 more elements
Dependencies are inferred from the claim text.