Power module and motor drive circuit

A power module comprising:

• a first die pad;
• a first switching element that is mounted on the first die pad;
• a second die pad that is electrically insulated from the first die pad;
• a second switching element that is mounted on the second die pad;
• an integrated circuit element that controls a switching operation of the first switching element and the second switching element;
• an encapsulation resin that encapsulates the first switching element, the second switching element, and the integrated circuit element;
• and
• a lead frame assembly that includes an outer lead, which protrudes from the encapsulation resin, and an inner lead, which is arranged in the encapsulation resin and electrically connected to the outer lead,
• wherein the lead frame assembly includes a first lead frame and a second lead frame,
• the first lead frame includes a first inner lead, which serves as the inner lead and is connected to the first die pad, and a first outer lead, which serves as the outer lead and is electrically connected to the first inner lead,
• the second lead frame includes a second inner lead, which serves as the inner lead and is connected to the second die pad, and a second outer lead, which serves as the outer lead and is electrically connected to the second inner lead, and
• the first switching element and the second switching element each have a superjunction structure,
• the power module further comprising a third die pad on which the integrated circuit element is mounted, wherein
• the lead frame assembly includes a plurality of lead frames that include at least the first lead frame and the second lead frame,
• the lead frames are arranged along a side surface of the encapsulation resin,
• when a direction in which the lead frames are arranged in the lead frame assembly is defined as a sideward direction, a direction perpendicular to the sideward direction in a plan view of the lead frame assembly is defined as a lengthwise direction, and a direction perpendicular to the sideward direction and the lengthwise direction is defined as a vertical direction, the third die pad is located at a position in the vertical direction separated from the first die pad and the second die pad,
• the lead frame assembly includes a fourth lead frame that forms a ground terminal,
• the fourth lead frame includes a connection portion that is electrically connected to the second switching element by a large-current connection member, and
• the connection portion is located between the third die pad and the second inner lead in the sideward direction.

A power module comprising:

• a first die pad;
• a first switching element that is mounted on the first die pad;
• a second die pad that is electrically insulated from the first die pad;
• a second switching element that is mounted on the second die pad;
• an integrated circuit element that controls a switching operation of the first switching element and the second switching element;
• an encapsulation resin that encapsulates the first switching element, the second switching element, and the integrated circuit element;
• and
• a lead frame assembly that includes an outer lead, which protrudes from the encapsulation resin, and an inner lead, which is arranged in the encapsulation resin and electrically connected to the outer lead,
• wherein the lead frame assembly includes a first lead frame and a second lead frame,
• the first lead frame includes a first inner lead, which serves as the inner lead and is connected to the first die pad, and a first outer lead, which serves as the outer lead and is electrically connected to the first inner lead,
• the second lead frame includes a second inner lead, which serves as the inner lead and is connected to the second die pad, and a second outer lead, which serves as the outer lead and is electrically connected to the second inner lead,
• the first switching element and the second switching element each have a superjunction structure,
• the lead frame assembly includes a plurality of lead frames including at least the first lead frame and the second lead frame,
• the lead frames are arranged along a side surface of the encapsulation resin, and
• when a direction in which the lead frames are arranged in the lead frame assembly is defined as a sideward direction and a direction perpendicular to the sideward direction in a plan view of the lead frame assembly is defined as a lengthwise direction, the first die pad includes a first recess located at a position separated from the first switching element on the first die pad in the lengthwise direction.