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US 10,832,995 B2Granted
Power module
AssigneeDanfoss Silicon Power GmbH
InventorsRonald Eisele, Frank Osterwald
Life of this patent
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Abstract
A power module (10) having a leadframe (20), a power semiconductor (30) arranged on the leadframe (20), a base plate (40) for dispersing heat generated by the power semiconductor (30) and a potting compound (50) surrounding the leadframe (20) and the power semiconductor (30), that physically connects the power semiconductor (30) and/or the leadframe (20) to the base plate(40).
Claims20
A method for manufacturing a power module having a leadframe, a power semiconductor, and a base plate, the method comprising the following steps:
- connecting the power semiconductor to the leadframe, and
- potting the power semiconductor connected to the leadframe with a potting compound while at the same time physically connecting the base plate to the potting compound,
- wherein the potting compound is an inorganic cement, and
- wherein the potting compound forms a layer arranged between the leadframe and the base plate to electrically insulate the power semiconductor from the base plate.
1 more element
Dependencies are inferred from the claim text.