Semiconductor device with external terminal

A semiconductor device, comprising:

• a conductive support having a support surface and a mounting surface facing opposite sides in a thickness direction, and an end surface intersecting with the mounting surface of the conductive support and facing outside;
• a semiconductor element having an element back surface facing the support surface of the conductive support and an electrode formed on the element back surface of the semiconductor element, in which the electrode is connected to the support surface of the conductive support;
• an external terminal electrically connected to the mounting surface of the conductive support and exposed to the outside;
• wherein the external terminal comprises a Ni layer having P and an Au layer, and respectively connected to and laminated with at least one portion of each of the mounting surface of the conductive support and the end surface of the conductive support;
• a sealing resin, in which the sealing resin has a resin back surface facing toward a same direction as the mounting surface of the conductive support and a resin lateral surface intersecting with the resin back surface of the sealing resin, and covers at least a portion of the conductive support and the semiconductor element;
• and
• an insulating film connected to a portion of the mounting surface of the conductive support and the resin back surface of the sealing resin, wherein the external terminal is exposed from the insulating film to the outside.