Sensor package and method

A method comprising:

• forming a back-side redistribution structure, the back-side redistribution structure having a first opening;
• adhering a sensor die in the first opening of the back-side redistribution structure with an adhesive, the sensor die having a first surface and a second surface opposite the first surface;
• encapsulating the sensor die with an encapsulant;
• forming a front-side redistribution structure over the encapsulant and the sensor die, the front-side redistribution structure having a second opening exposing the second surface of the sensor die;
• and
• after forming the front-side redistribution structure, removing at least a portion of the adhesive to expose the first surface of the sensor die.

A method comprising:

• adhering a sensor die to a carrier substrate with an adhesive, the sensor die comprising:
• a semiconductor substrate;
• die connectors on the semiconductor substrate;
• a dielectric layer surrounding the die connectors;
• a sacrificial film having a first portion on the dielectric layer and a second portion extending through the dielectric layer;
• encapsulating the sensor die with an encapsulant;
• planarizing the encapsulant such that top surfaces of the encapsulant and the sacrificial film are coplanar;
• removing the second portion of the sacrificial film to form a first opening in the dielectric layer;
• forming a front-side redistribution structure over the encapsulant and the sensor die, the front-side redistribution structure having a second opening exposing the first opening;
• debonding the sensor die from the carrier substrate;
• and
• removing at least a portion of the adhesive to expose the semiconductor substrate.