Electronic component housing package, multi-piece wiring substrate, electronic apparatus, and electronic module

An electronic component housing package, comprising:

• an insulating substrate having a first principal face and a second principal face opposing the first principal face, the insulating substrate having a lower insulating layer including the second principal face, the lower insulating layer having a mounting section for mounting an electronic component, and a frame-shaped upper insulating layer including the first principal face, the frame-shaped upper insulating layer being provided on the lower insulating layer so as to surround the mounting section;
• a plurality of external connection conductors provided on the second principal face;
• and
• connection conductors provided so as to extend from outer peripheral ends of the external connection conductors to outer peripheral ends of the insulating substrate, respectively,
• the connection conductors being provided over a range from the outer peripheral ends of the external connection conductors to the outer peripheral ends of the insulating substrate so that a distance from each of the connection conductors to the second principal face is increased in a thickness direction of the insulating substrate,
• insulating bodies being provided so as to cover the connection conductors, respectively,
• parts of the connection conductors which are exposed to outer peripheral side surfaces of the insulating substrate, respectively, being separated from the second principal face via the respective insulating bodies in the thickness direction of the insulating substrate.