Non-embedded silicon bridge chip for multi-chip module
AssigneeInternational Business Machines Corporation
InventorEffendi Leobandung
Life of this patent
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Abstract
A semiconductor structure includes a free-floating silicon-bridge chip electrically joined on a top portion to two or more semiconductor chips and electrically joined on a bottom portion to a substrate structure that includes a plurality of metal interconnect structures and a plurality of metal layers disposed on an interlevel dielectric. The silicon bridge chip is aligned with and extends into a recess located in a region of the substrate structure away from the plurality of metal interconnect structures and the plurality of metal layers such that a top surface of the silicon bridge chip is substantially flush with a top surface of the substrate structure.
Claims9
A semiconductor structure comprising:
- a silicon-bridge chip comprising a free-floating device electrically joined on a top portion to two or more semiconductor chips and electrically joined on a bottom portion to a substrate structure, the substrate structure comprising a plurality of metal interconnect structures and a plurality of metal layers disposed on an interlevel dielectric,
- a region of the substrate structure having a recess, the silicon bridge chip being aligned with and extending into the recess, a size of the recess is larger than a size of the silicon-bridge chip causing a separation space between sidewalls of the silicon-bridge chip and sidewalls of the substrate structure, the region of the substrate structure being away from the plurality of metal interconnect structures and the plurality of metal layers such that a top surface of the silicon bridge chip is substantially flush with a top surface of the substrate structure.
Dependencies are inferred from the claim text.