Multi-layer tethers for micro-transfer printing

A micro-device structure, comprising:

• a source substrate comprising anchors that are spaced apart and recessed portions between the anchors;
• and
• a micro-device disposed exclusively over each of the recessed portions and laterally attached to one of the anchors by a multi-layer tether, thereby defining a gap between the micro-device and the source substrate, wherein the gap is exposed through an opening,
• wherein the micro-device has at least one of a length greater than or equal to 250 μm, a width greater than or equal to 250 μm, and a thickness greater than or equal to 5 μm.

A micro-device structure, comprising:

• a source substrate comprising sacrificial portions laterally spaced apart by anchors, wherein at least a portion of each of the sacrificial portions is exposed through an opening;
• and
• a micro-device disposed exclusively in direct contact with each of the sacrificial portions and laterally attached to one of the anchors by a multi-layer tether,
• wherein the multi-layer tether comprises a first tether layer adjacent to the source substrate and a second tether layer on a side of the first tether layer opposite the source substrate, and
• wherein the first tether layer extends over at least a portion of the micro-device, wherein the second tether layer extends over at least a portion of the micro-device, or wherein the first tether layer extends over at least a first portion of the micro-device and the second tether layer extends over at least a second portion of the micro-device.

A micro-device structure, comprising:

• a source substrate comprising sacrificial portions laterally spaced apart by anchors, wherein at least a portion of each of the sacrificial portions is exposed through an opening;
• and
• a micro-device disposed exclusively in direct contact with each of the sacrificial portions and laterally attached to one of the anchors by a multi-layer tether,
• wherein the micro-device has a thickness greater than or equal to 5 μm.

A micro-device structure, comprising:

• a source substrate comprising sacrificial portions laterally spaced apart by anchors, wherein at least a portion of each of the sacrificial portions is exposed through an opening;
• and
• a micro-device disposed exclusively in direct contact with each of the sacrificial portions and laterally attached to one of the anchors by a multi-layer tether,
• wherein the micro-device has one or more of a length greater than or equal to 250 μm and a width greater than or equal to 250 μm.

A micro-device structure, comprising:

• a source substrate comprising sacrificial portions laterally spaced apart by anchors, wherein at least a portion of each of the sacrificial portions is exposed through an opening;
• and
• a micro-device disposed exclusively in direct contact with each of the sacrificial portions and laterally attached to one of the anchors by a multi-layer tether,
• wherein the micro-device has at least one of a length and a width that is two to four times a length of the multi-layer tether.

A micro-device structure, comprising:

• a source substrate comprising anchors that are spaced apart and recessed portions between the anchors;
• and
• a micro-device disposed exclusively over each of the recessed portions and laterally attached to one of the anchors by a multi-layer tether, thereby defining a gap between the micro-device and the source substrate, wherein the gap is exposed through an opening,
• wherein the multi-layer tether comprises a first tether layer adjacent to the source substrate and a second tether layer on a side of the first tether layer opposite the source substrate, wherein the first tether layer extends over at least a portion of the micro-device, wherein the second tether layer extends over at least a portion of the micro-device, or wherein the first tether layer extends over at least a first portion of the micro-device and the second tether layer extends over at least a second portion of the micro-device, and
• wherein the micro-device comprises one or more contact pads and the first tether layer encapsulates the micro-device except for the one or more contact pads and the second tether layer encapsulates the micro-device including the one or more contact pads.