Dry-etching of carrier substrate for microLED microassembly
AssigneeFacebook Technologies, LLC
InventorsDaniel Brodoceanu, Oscar Torrents Abad
Life of this patent
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Abstract
A method of placing light emitting diodes (LEDs) includes embedding an array of LEDs in a polymer layer on a substrate. The method includes detaching at least one LED in the array of LEDs from the substrate by dry-etching the polymer layer in which at least one LED is embedded. A pick-up-tool (PUT) is brought into contact with at least one surface of at least one LED facing away from the substrate, responsive to dry-etching the polymer layer. The PUT is lifted with the at least one LED attached to the PUT.
Claims17
A method of transferring light emitting diodes (LEDs) comprising:
- embedding an array of LEDs in a polymer layer on a top flat surface of a flat substrate with electrodes of the LEDs protruding from surfaces of bodies of the LEDs facing towards the flat substrate and protruding through the polymer layer, the electrodes of the LEDs between the bodies of the LEDs and the flat substrate, and the polymer layer directly contacting the array of LEDs and the flat substrate;
- and
- detaching at least one LED in the array of LEDs from the flat substrate by:
- dry-etching the polymer layer in which the at least one LED is embedded,
- bringing a pick-up-tool (PUT) into contact with at least one surface of the at least one LED facing away from the flat substrate responsive to dry-etching the polymer layer, and
- lifting the PUT with the at least one LED attached to the PUT to detach the electrodes of the LEDs from the flat substrate.
A non-transitory computer-readable storage medium storing processor executable instructions, the instructions comprising instructions for:
- embedding an array of LEDs in a polymer layer on a top flat surface of a flat substrate with electrodes of the LEDs protruding from surfaces of bodies of the LEDs facing towards the flat substrate and protruding through the polymer layer, the electrodes of the LEDs between the bodies of the LEDs and the flat substrate, and the polymer layer directly contacting the array of LEDs and the flat substrate;
- and
- detaching at least one LED in the array of LEDs from the flat substrate by:
- dry-etching the polymer layer in which the at least one LED is embedded,
- bringing a pick-up-tool (PUT) into contact with at least one surface of the at least one LED facing away from the flat substrate responsive to dry-etching the polymer layer, and
- lifting the PUT with the at least one LED attached to the PUT to detach the electrodes of the LEDs from the flat substrate.
Dependencies are inferred from the claim text.