Semiconductor product testing device using an electric static carrier

A semiconductor product testing device using an electric static carrier, comprising:

• a movable carrier plate capable of carrying at least one semiconductor product thereon;
• the movable carrier plate serving to carry the at least one semiconductor product for transferring or testing process;
• the movable carrier plate being arranged with at least one electric static circuit for generating static electricity to suck the at least one semiconductor product;
• a movable detecting probe set including:
• a probe set includes at one probe or a plurality of probes;
• a robot being connected to the probe set for deriving the probe set to a predetermined test position so that the probe or probes are connected to the joints of the at least one semiconductor product for testing;
• a control device connected to the robot and including a control circuit for controlling movements of the robot and a testing circuit;
• the testing circuit acquiring data through the probe or probes;
• a computer connected to the control device for getting testing data from the testing circuit;
• the computer providing functions to cause the user to determine test items and ways of the testing circuit and the moving paths of the robot;
• wherein the electric state circuit includes an electrode pair which has two electrodes arranged at two ends of the electric static circuit and extend downwards;
• each of the electrodes penetrating through the movable carrier plate and exposes out of a lower end of the movable carrier plate;
• wherein the movable carrier plate is formed with pores firstly and electric conduction material is filled in the pores;
• the pores are paired and thus the electric conduction materials are formed as pairs and expose out of a lower surface of the movable carrier plate to be as the electrodes of the electrode pair of the electric static circuit;
• and
• a layer of copper, a layer nickel and a layer gold are plated on the movable carrier plate sequentially so as to form as a thin film;
• the copper is at the inner side of the thin film to contact the movable carrier plate;
• and then by etching process, the undesired material is etched, and those left is the electric static circuit;
• the electric static circuit must be made to be corresponding to the electrode pair.