Electrostatic chuck with embossed top plate and cooling channels
AssigneeApplied Materials, Inc.
InventorsChethan Mangalore, Arumuga Balan, Jeonghoon Oh
Life of this patent
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AssigneeApplied Materials, Inc.
InventorsChethan Mangalore, Arumuga Balan, Jeonghoon Oh
Estimating the term…
An electrostatic chuck for retaining a substrate is provided herein. In some embodiments, an electrostatic chuck for retaining a substrate may include a susceptor including an electrically conductive susceptor base having one or more cooling channels formed in an upper surface thereof; a raised central support disposed over the one or more cooling channels; and a dielectric top plate disposed on the raised central support, wherein the dielectric top plate has an embossed top surface, and wherein the dielectric top plate and raised central support include a plurality of holes to facilitate delivery of a cooling gas one or more cooling channels to a backside of the substrate when disposed on the embossed top surface of the dielectric top plate.
An electrostatic chuck for retaining a substrate, comprising:
An apparatus for processing a substrate, comprising:
An electrostatic chuck for retaining a 150 mm substrate, comprising:
Dependencies are inferred from the claim text.