Lower plasma-exclusion-zone rings for a bevel etcher
AssigneeLam Research Corporation
InventorsTong Fang, Yunsang Kim, Keechan Kim, George Stojakovic
Life of this patent
Estimating the term…
Loading patent…
AssigneeLam Research Corporation
InventorsTong Fang, Yunsang Kim, Keechan Kim, George Stojakovic
Estimating the term…
A lower plasma-exclusion-zone ring for a bevel etcher is provided that is configured to etch a bevel edge of a substrate. The lower plasma-exclusion-zone ring includes a ring-shaped body and a radially-outer stepped surface. The ring-shaped body of the lower plasma-exclusion-zone ring defines an upper surface, a lower surface, a radially inner surface, and a radially outer surface. The radially-outer stepped surface of the lower plasma-exclusion-zone ring extending inwardly into the ring-shaped body between the radially outer surface of the ring-shaped body and the upper surface of the ring-shaped body. The ring-shaped body is made of a material selected from a group consisting of aluminum oxide, aluminum nitride, silicon, silicon carbide, silicon nitride, and yttria.
A system for a bevel etcher that is configured to etch a bevel edge of a substrate, the system comprising:
A lower plasma-exclusion-zone ring for a bevel etcher that is configured to etch a bevel edge of a substrate, the lower plasma-exclusion-zone ring comprising:
A system for a bevel etcher that is configured to etch a bevel edge of a substrate, the system comprising:
Dependencies are inferred from the claim text.