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US 10,832,921 B2Granted
Electronic device with top side pin array and manufacturing method thereof
AssigneeAmkor Technology, Inc.
InventorsDevarajan Balaraman, Daniel Richter, Greg Hames, Dean Zehnder, Glenn Rinne
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Abstract
An electronic device and a manufacturing method thereof. As non-limiting examples, various aspects of this disclosure provide an electronic device having a top side pin array, for example which may be utilized for three-dimensional stacking, and a method for manufacturing such an electronic device.
Claims20
An electronic device comprising:
- a lower redistribution structure comprising an upper surface and a lower surface, the upper surface comprising a conductive portion and a die-attach pad;
- a semiconductor die attached and electrically coupled to the die-attach pad;
- an upper redistribution structure comprising an upper surface and a lower surface, the lower surface comprising a conductive portion;
- and
- a non-plated pin comprising:
- a lower end attached to the conductive portion of the lower redistribution structure via a solder member;
- and
- an upper end attached to the conductive portion of the upper redistribution structure.
5 more elements
An electronic device comprising:
- a lower redistribution structure comprising an upper surface and a lower surface, the upper surface comprising a conductive portion and a die-attach pad;
- a semiconductor die attached and electrically coupled to the die-attach pad;
- a pin comprising a lower end and an upper end, the lower end attached to the conductive portion of the lower redistribution structure via a conductive adhesive;
- encapsulating material that encapsulates and directly contacts:
- a lateral side of the pin;
- and
- a lateral side of the semiconductor die;
- and
- an upper redistribution structure comprising a conductive layer and a dielectric layer built on an upper surface of the encapsulating material such that:
- a conductive portion of conductive layer is attached to an upper end of the pin;
- and
- a lower surface of the dielectric layer, a lower surface of the upper redistribution structure, and a lower surface of the conductive layer are coplanar.
9 more elements
An electronic device comprising:
- a lower redistribution structure comprising an upper surface and a lower surface, the upper surface comprising a conductive portion and a die-attach pad;
- a semiconductor die attached and electrically coupled to the die-attach pad;
- an upper redistribution structure comprising an upper surface and a lower surface, the lower surface comprising a conductive portion;
- and
- a pin attached to:
- the conductive portion of the lower redistribution structure via a solder member;
- and
- the conductive portion of the upper redistribution structure;
- wherein the pin comprises a first end, a second end, a main body that extends from the first end to the second end, and a head at the first end;
- and
- wherein the head of the pin has a greater diameter than the main body of the first pin.
8 more elements
Dependencies are inferred from the claim text.