Methods of fabricating a device
AssigneeMicron Technology, Inc.
InventorKuo-Yao Chou
Life of this patent
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Abstract
A method for processing a substrate is provided. The method comprises forming a patterned photoresist over a first material, the patterned photoresist comprising island portions and shaped spaces surrounding the island portions. An area of each of the island portions is reduced to enlarge the shaped spaces, which are filled with a second material. The island portions are removed to form first openings in the second material. Portions of the first material exposed through the first openings are removed to form second openings in the first material. Portions of a substrate exposed through the second openings are removed to form holes in the substrate. Methods of patterning a substrate and methods of forming a hole pattern in a substrate are also disclosed.
Claims20
A method of fabricating a device, comprising:
- patterning a photoresist over a first material over a target material, the patterned photoresist comprising island portions and spaces laterally adjacent to the island portions;
- removing peripheral portions of the island portions to enlarge the spaces;
- forming a second material over the island portions and between the enlarged spaces;
- removing the second material from over the island portions without removing the second material from between the enlarged spaces and a top surface of the second material substantially coplanar with a top surface of the island portions;
- removing the island portions to form first openings in the second material;
- forming second openings in the first material exposed through the first openings;
- and
- removing the target material exposed through the second openings to form holes in the target material.
A method of fabricating a device, comprising:
- patterning a photoresist adjacent a first material, the patterned photoresist comprising patterned photoresist portions and spaces laterally adjacent to the patterned photoresist portions and the first material adjacent a target material;
- removing peripheral portions of the patterned photoresist portions to increase a width of the spaces;
- forming a second material in the spaces, the second material in contact with and extending between sidewalls of adjacent patterned photoresist portions and a top surface of the patterned photoresist portions exposed between adjacent second materials;
- removing the patterned photoresist portions to form first openings in the second material;
- forming second openings in the first material below the first openings;
- and
- removing the target material exposed through the second openings to form holes in the target material.
A method of fabricating a device, comprising:
- patterning a photoresist adjacent a first material, the photoresist comprising ring-shaped portions spaced apart from one another and the first material adjacent a target material;
- removing portions of the ring-shaped portions to enlarge spaces between the ring-shaped portions;
- forming a second material between the ring-shaped portions, the second material extending between sidewalls of adjacent ring-shaped portions and a top surface of the second material substantially coplanar with a top surface of the island portions;
- removing the ring-shaped portions to expose a portion of the first material;
- removing the exposed portion of the first material to form openings in the first material;
- and
- removing a portion of the target material exposed through the openings in the first material to form holes in the target material.
A method of fabricating a device, comprising:
- patterning a photoresist over a first material over a target material, the patterned photoresist comprising island portions and spaces laterally adjacent to the island portions;
- removing peripheral portions of the island portions to enlarge the spaces;
- forming a second material between the enlarged spaces, the second material extending between sidewalls of adjacent island portions and a top surface of the second material substantially coplanar with a top surface of the island portions;
- removing the island portions to form first openings in the second material;
- forming second openings in the first material exposed through the first openings;
- and
- removing the target material exposed through the second openings to form holes in the target material.
Dependencies are inferred from the claim text.