Substrate processing apparatus and substrate processing method
AssigneeTokyo Electron Limited
InventorsYoshinori Ikeda, Yuki Taniguchi, Kazuyoshi Shinohara
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Abstract
Disclosed is a substrate processing apparatus including: a holding unit that holds a substrate; a processing liquid supply unit that supplies a processing liquid to the substrate; a cup that includes a bottom portion, a tubular peripheral wall portion erected on the bottom portion, a liquid receiving portion provided above the peripheral wall portion and configured to receive the processing liquid scattered from the substrate, and a groove portion formed in a circumferential direction on an upper surface of the peripheral wall portion, and surrounds the holding unit; and a cleaning liquid supply unit that supplies a cleaning liquid to the upper surface of the peripheral wall portion.
Claims14
A substrate processing apparatus comprising:
- a substrate holder configured to hold a substrate;
- a processing liquid supply source configured to supply a processing liquid to the substrate;
- a cup including a bottom portion, a tubular peripheral wall portion erected on the bottom portion, a liquid receiving plate provided above and separate from the peripheral wall portion and configured to receive the processing liquid scattered from the substrate, a support rod configured to support the liquid receiving plate and move the liquid receiving plate up and down with respect to the peripheral wall portion, an insertion hole formed inside the peripheral wall portion to allow the support rod to be inserted therethrough, and a groove portion formed in a circumferential direction on an upper surface of the peripheral wall portion, the upper surface of the peripheral wall portion facing the liquid receiving plate, the cup being configured to surround the substrate holder;
- and
- a cleaning liquid supply source configured to supply a cleaning liquid to the upper surface of the peripheral wall portion.
Dependencies are inferred from the claim text.